Ceramic components
Our expansive facilities cover an area exceeding 220,000 square feet, enabling us to accommodate various production needs. With our comprehensive in-house capabilities, we specialize in optical coating, metalization, plating, etching, lithography, wire bonding, and more.
We take pride in delivering reliable mass production quality for a range of ceramic components, including DPC components, HTCC ceramic shell, ceramic submount, high frequency connectors, insulators, Tantalum Capacitors etc. Our expertise allows us to customize ceramic components with design rules to meet our customers' specific requirements.
To ensure exceptional customer service, our team is available 24/7, including weekends, enabling quick turn-around times and fast order delivery.
Material: ALN
Thermal conductivity：170w/(m·k)、200w/(m·k)、230w/(m·k)
Substrate thickness：0.337±0.01μm、0.345±0.01μm
Graphics spacing：≥100μm
Laser drilling：60-150μm
Thick Cu：80±20μm，Ni：3-5μm，Au≥1μm，Pt：0.25μm min
AuSn：3.5±0.5μm，Au75±5wt%（5.0±1.0μm），
Au Flush：0.1μm Typ.
Production capacity: 1000,000 pieces / week
Material: Alumina (ALN), Alumina white porcelain (AL2O3)
Alumina black porcelain (AL2O3)
Thermal conductivity: ALN > 170, AL2O3(white) >15, AL2O3(black) >12
Internal metallized material: Tungsten
Dimension: 100 x 100mm (Max), thickness 0.3 ~ 4.0 mm
thickness of single layer 0.1 ~ 0.2 mm.
Number of layers: 2 ~ 30 layers
Production capacity: 10,000 pieces / month
Material: AL2O3 , ALN170w/(m·k) 200w/(m·k) 230w/(m·k)
Thickness：0.127, 0.254, 0.38, 0.5, 0.8, 1.0 mm
Film structure: CrNiAu , TiPtAu
Strip width: 15μm (Min.) Space width: 12μm (Min.)
Minimum size: 0.2 mm x 0.2 mm
Production capacity: 200,000 pieces / week